Hangke Precision
We providecustomizedservices,
Different types of products,
Provide the best solution,
Make every clientsatisfied!
Specializing in the research and development of all kinds of high-performance, low-cost Burn-in & Test Socket and all kinds of IC test fixtures, suitable for a variety of packages: BGA, PGA, QFN, GCSP, CLCC, QFP, TSOP....... as well as IGBT, SiC modules.

Subject PPS+gf30 (Black)
contact pogopin
Plating Au plating (Ni-base)
Rated Current 1A
Insulation Resistance 1000mΩ min. at 500V DC
Contact Resistance 100mΩ max. at 100mA max
Packaging DCM

Subject PPS+gf30 (Black)
contact pogopin
Plating Au plating (Ni-base)
Rated Current 1A
Insulation Resistance 1000mΩ min. at 500V DC
Contact Resistance 100mΩ max. at 100mA max
Packaging BGA